任職要求：?1.?Have?experience?in?package?design?in?BGA?package?or?lead?frame?design?and?process?development?
2.?Good?knowledge?one?of?package?design?tools?(?such?as?AutoCad,?APD?and?UPD)?or?PCB?Design?tools?is?a?plus.?
4.?Must?be?detail?oriented?in?design?specifications,?implementation?and?reviews?with?customers.
5.?Familiarity?with?IC?Packaging?Assembly/?processes,?and?have?IC?packaging?process?development?or?packaging?design?experience?as?plus.
6.?Good?technical?knowledge?reliability?stress?testing.
7.?Good?written?and?oral?communication?skills.
8.?A?Background?in?substrate/PCB?manufacturing?processes?is?needed
9.?BS?/?MS?degree?in?Electrical?Engineering,?or?Materials?Science,?or?Mechanical?Engineering?
職位職責：?1.?As?a?member?of?Assembly?Packaging?RD?Group?work?with?sales?to?support?customers?various?packaging?design?and?substrate/Leadframe?design?to?meet?customer?satisfaction.
2.?Provide?the?package?in-house?design/DFEMA?review?and?also?external?customer?review?to?meet?both?requirements.
3.?Responsible?for?documentation?associated?with?design?related?drawings,?and?release?for?tooling?with?suppliers.?
4.?Support?BOM?generation?and?package?cost?calculation.
5.?Work?directly?with?other?teams?to?align?package?design/new?process?and?materials?necessary?to?support?program?schedule?and?readiness?for?customer?prototypes?and?production.?
6.?Project?management?for?new?material?supplier?qualification?or?new?package?product?introduction,?coordination?of?activities?between?various?engineering?organizations.?Follow?up?and?update?the?project?progress?in?time?through?communicating?with?functional?groups.
7.?Technical?support?for?production?line?to?solving?process?problem?and?improve?production?yield.
8.?Initiate?to?conduct?package?cost?reduction?during?initial?design,?and?support?cost?reduction?activities.?
9.?Work?closely?with?headquarter?to?align?the?new?package?development.
10.?Available?for?Oversea?training?or?support?when?assigned